Lenovo Unveils Low Temperature Solder Process, a ‘Breakthrough’ in PC Manufacturing
PC and mobile giant Lenovo on Thursday announced it has developed a new PC manufacturing process making printed circuit boards (PCBs) that conserves energy and increases reliability, apart from reducing carbon emissions. Lenovo says the patent-pending #LowTemperatureSolder (LTS) process will effectively replace the current tin-based process that requires high temperatures, causing component stress. Lenovo says the LTS process is planned to be rolled out across eight surface mount technology (SMT) assembly in 2017, providing carbon emission savings up to 35 percent. It adds it expects to have 33 SMT lines with 2 ovens per line using this new process by the end of 2018, “giving an estimated annual saving of 5,956 metric tonnes of CO2”. The same year, Lenovo says it intends “to offer the new procedure for use on an industry-wide basis free of charge.” It says the process can be applied to all electronics manufacturing involving printed circuit boards.