3D NAND flash output to increase in 2H 2017
Industry attempts to close global supply shortages According to sources within the memory industry, global production of #3DNAND flash memory chips is expected to expand substantially in the second half of 2017, exceeding the output of 2D NAND chips by the fourth quarter of the year. Sources say that yield rates for major suppliers of 3D NAND technology have been relatively instable since the beginning of 2017. Suppliers including #Samsung Electronics, #Micron, #WesternDigital and #Toshiba have all introduced 64-layer 3D NAND flash products, while #SKHynix recently introduced the industry’s first 72-layer 3D NAND chips. As chipmakers position themselves for increased expansion of 3D NAND output, the output for 2D NAND is expected to be reduced substantially. Samsung, for instance, is expected to begin operating a new plant in Pyeongtaek in July to further expand its 3D NAND production capacity. Micron will start producing 64-layer 3D NAND chips in the second quarter, with mass shipments becoming ready for the second half of the year. The company promises “meaningful output” by the end of their fiscal year in December.